4. Photography and optical equipment
  5. Camera or body therefor
  6. Separate lens and viewfinder

Min-Chul Kim

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Bonding pad structure of a semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Bonding pad structure of a semiconductor device and method...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Camera with a function of sound recording

Photography and optical equipment – Camera or body therefor – Separate lens and viewfinder
Design Patent

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METHODS OF FORMING A TRENCH ISOLATION REGION IN A SUBSTRATE...

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2342008

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