Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1999-02-19
2000-09-19
Heinrich, Samuel M.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
2281245, 228208, 228227, B23K 3100, B23K10140, G02B 1318
Patent
active
061199214
ABSTRACT:
The invention is a method and resulting device which provides a strong bond between a silicon substrate and an oxide component mounted within a cavity in the substrate. A layer of titanium, for example, is deposited on the walls of the cavity, followed by deposition of a layer of aluminum. The structure is preferably annealed to form titanium silicide and titanium-aluminum interface layers. The component is then bonded to the aluminum layer.
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Brady Michael Francis
Dautartas Mindaugas Fernand
Dormer James F.
Merchant Sailesh Mansinh
Nijander Casimir Roman
Birnbaum Lester H.
Heinrich Samuel M.
Lucent Technologies
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