4. Semiconductor device manufacturing: process
  5. Chemical etching
  6. Liquid phase etching

James F. Dormer

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Bonding of aluminum oxide components to silicon substrates

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Bonding of aluminum oxide components to silicons substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Patent

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Fabrication of semiconductor devices

Classifying – separating – and assorting solids – Sorting special items – and certain methods and apparatus for... – Condition responsive means controls separating means
Patent

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Lid guide for electronic devices

Package making – Closing packages and filled receptacles – Separate closure applying
Patent

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Method and apparatus for passively aligning components on...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Thermally responsive
Reexamination Certificate

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Profile ID: LFUS-PAI-P-207307

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