Bonded wafer optical MEMS process

Details Bonded wafer optical MEMS process Bonded wafer optical MEMS process

2006-08-01

2006-08-01

Smoot, Stephen W. (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S455000, C438S739000

Reexamination Certificate

active

07083997

ABSTRACT:
A microelectromechanical system is fabricated from a substrate having a handle layer, a silicon sacrificial layer and a device layer. A micromechanical structure is etched in the device layer and the underlying silicon sacrificial layer is etched away to release the micromechanical structure for movement. One particular micromechanical structure described is a micromirror.

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