4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Test or calibration structure

Ming-Yao Chen

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Bond quality indication by bump structure on substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Reexamination Certificate

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Semiconductor chip having TSV (through silicon via) and...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3162928

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