Bond pad

Details Bond pad Bond pad

2006-06-06

2006-06-06

Vu, David (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S774000

Reexamination Certificate

active

07056820

ABSTRACT:
A bond pad upon which a wirebond interconnection is formed, consisting of a first bond pad layer formed on a chip, and a second bond pad layer formed on the first bond pad layer, wherein the first bond pad layer is more resistant to removal than the second bond pad layer during probe testing, and the first bond pad layer increases resistance to interconnection failure during mechanical testing.

REFERENCES:
patent: 5225372 (1993-07-01), Savkar et al.
patent: 5290588 (1994-03-01), Romero et al.
patent: 5356836 (1994-10-01), Chen et al.
patent: 5990011 (1999-11-01), McTeer
patent: 6037668 (2000-03-01), Cave et al.
patent: 6130156 (2000-10-01), Havemann et al.
patent: 6175154 (2001-01-01), Gillespie
patent: 6417572 (2002-07-01), Chidambarrao et al.

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