4. Semiconductor device manufacturing: process
  5. Making field effect device having pair of active regions...
  6. Having insulated gate

Barbara A. Waterhouse

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Bond pad

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Non-Continuous encapsulation layer for MIM capacitor

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate

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Optimum padset for wire bonding RF technologies with high-Q...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2833212

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