Blanket etching process for formation of tungsten plugs

Details Blanket etching process for formation of tungsten plugs Blanket etching process for formation of tungsten plugs

1997-05-15

1999-06-22

Everhart, Caridad

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438714, 438720, 438643, H01L 21461

Patent

active

059152028

ABSTRACT:
An improved and new method of forming tungsten plugs on contact holes in semiconductor integrated circuit devices has been developed. The method uses a two step tungsten etchback process wherein redeposition of etch byproducts is surpressed, residue removal is enhanced, and the overetching requirement is reduced. The result is a more reliable, lower cost, higher yield process.

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patent: 5521119 (1996-05-01), Chen et al.
patent: 5521121 (1996-05-01), Tsai et al.
patent: 5677237 (1997-10-01), Tsai et al.

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