Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-03-27
1987-04-14
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156646, 156652, 156653, 156644, 156657, 1566611, 156662, 156668, 156904, 427 431, 430312, 430313, 430317, 20419232, H01L 21306, B44C 122, C03C 1500, B29C 3700
Patent
active
046576290
ABSTRACT:
A bilevel photoresist process employs a first relatively thick photoresist layer deposited over the surface to be patterned. The entirety of this first photoresist layer is exposed to actinic ultraviolet radiation and thereafter subjected to a heat treatment so as to effectively desensitize the layer to the action of a developing agent. Patterning of this first layer is accomplished by depositing a second, relatively thin photoresist layer on the effectively planarized surface of the first layer, selectively exposing the second layer to a mask pattern to be used for patterning the underlying semiconductor structure and thereafter developing the second layer of photoresist. Because of its thickness the first layer effectively acts as an optical buffer between the second relatively thin layer and any underlying metallic reflective interface, so that optical notching of the second layer of photoresist cannot occur. In addition, because the first layer has been completely desensitized to photodeveloping agents, etching through the second layer terminates at the top surface of the first layer. Following patterning of the second photoresist layer, the bilevel photoresist structure is exposed to a reactive ion etch (RIE) which effectively maps the aperture pattern of the second photoresist layer into and through the first photoresist layer.
REFERENCES:
patent: 4201800 (1980-05-01), Alcorn et al.
patent: 4434224 (1984-02-01), Yoshikawa et al.
patent: 4599137 (1986-07-01), Akiya
Harris Corporation
Powell William A.
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