Bi-layer silicon film and method of fabrication

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Polycrystalline semiconductor

Reexamination Certificate

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C438S684000, C438S764000, C438S969000

Reexamination Certificate

active

06991999

ABSTRACT:
A bi-layer silicon electrode and its method of fabrication is described. The electrode of the present invention comprises a lower polysilicon film having a random grain microstructure, and an upper polysilicon film having a columnar grain microstructure.

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Bu, H. et al., “Investigation of Polycrystalline Silicon Grain Structure with Single Wafer Chemical Deposition” Journal of Vacuum Science and Technology, vol. 19, No. 4, Jul. 2001, pp. 1898-1901, XP0022221378.

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