4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified configuration

Sung Eun Park

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active

BGA package having half-etched bonding pad and cut plating...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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BGA package with concave shaped bonding pads

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Method for manufacturing a semiconductor device capable of...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having junction gate
Reexamination Certificate

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Profile ID: LFUS-PAI-P-3160774

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