Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-03-06
2007-03-06
Malsawma, Lex H. (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE21588
Reexamination Certificate
active
10889203
ABSTRACT:
A method for forming conductive contacts and interconnects in a semiconductor structure, and the resulting conductive components are provided. In particular, the method is used to fabricate single or dual damascene copper contacts and interconnects in integrated circuits such as memory devices and microprocessor.
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Ahn Kie Y
Forbes Leonard
Malsawma Lex H.
Micro)n Technology, Inc.
Whyte Hirschboeck Dudek SC
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