4. Metal fusion bonding
  5. Process
  6. Plural joints

Kyu-Jin Lee

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Ball grid array package, stacked semiconductor package and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Dongle for receiving digital TV broadcasting

Recording – communication – or information retrieval equipment – Recording media or carrier – Flash drive type
Design Patent

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Semiconductor chip package comprising enhanced pads

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Virtual multi-antenna method for OFDM system and OFDM-based...

Multiplex communications – Generalized orthogonal or special mathematical techniques – Particular set of orthogonal functions
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2685477

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