Backside rapid thermal processing of patterned wafers

Details Backside rapid thermal processing of patterned wafers Backside rapid thermal processing of patterned wafers

2006-12-14

2008-08-19

Paik, S (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C392S416000

Reexamination Certificate

active

07414224

ABSTRACT:
Apparatus and methods of thermally treating a wafer or other substrate, such as rapid thermal processing (RTP) apparatus and methods are disclosed. An array of radiant lamps directs radiation to the back side of a wafer to heat the wafer. In one or more embodiments, the front side of the wafer on which the patterned integrated circuits are being formed faces a radiant reflector. In one or more embodiments, the wafer is thermally monitored for temperature and reflectivity from the side of the reflector.

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