Etching a substrate: processes – Nongaseous phase etching of substrate – Using film of etchant between a stationary surface and a...
Reexamination Certificate
2005-07-26
2005-07-26
Hassanzadeh, P. (Department: 1763)
Etching a substrate: processes
Nongaseous phase etching of substrate
Using film of etchant between a stationary surface and a...
C216S092000, C134S902000
Reexamination Certificate
active
06921494
ABSTRACT:
A scrubber device is provided. The scrubber device may etch a backside of a wafer and may clean a frontside of the wafer simultaneously. The scrubber device may comprise a programmed controller adapted to supply a non-etching fluid to a frontside of the wafer whenever an etching fluid is supplied to the backside of the wafer.
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Brown Brian J.
Chandrachood Madhavi
Nayak Radha
Redeker Fred C.
Sugarman Michael
Applied Materials Inc.
Culbert Roberts
Dugan & Dugan
Hassanzadeh P.
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