4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Abhay Maheshwari

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Backside encapsulation of tape automated bonding device

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Backside encapsulation of tape automated bonding device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
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Integrated circuit and method of producing a carrier wafer...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Method and apparatus for cleaning and removing flux from an...

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Reexamination Certificate

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Method and system for manufacturing integrated molded...

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – To produce composite – plural part or multilayered article
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1514959

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