4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

John Nielbing

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Backside encapsulation of tape automated bonding device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent

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Method for cleaning and disinfecting soft contact lens and treat

Chemistry: electrical and wave energy – Processes and products – Electrostatic field or electrical discharge
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Profile ID: LFUS-PAI-P-1514960

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