Automatic package inspection method

Optics: measuring and testing – By configuration comparison – With comparison to master – desired shape – or reference voltage

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382 8, 382 22, 356237, 358106, 358107, G01B 1100, H04N 718, G06K 900

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active

051373629

ABSTRACT:
A real time automatic visual semiconductor package inspection method is provided wherein a direction edge enhancement is performed on an image of the package. The direction edge enhanced image is dilated and correlated to a stored direction edge shape to identify all shapes of interest in a package under inspection. Also, anomalous shapes and uncorrelated direction edge shapes are identified and dilated. The dilated direction edge shape is analyzed using relatively simple mathematic techniques such as counting the number of shapes of a particular type, transforming shapes of interest to identify points of interest, and measuring relative position between the points of interest to determine acceptability of the semiconductor package. Also, size and location of anomalous shapes are calculated to determine acceptability of the package.

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