Automatic lapping method of a thin film element and a lapping ap

Details Automatic lapping method of a thin film element and a lapping ap Automatic lapping method of a thin film element and a lapping ap

1997-12-11

2000-10-17

Morgan, Eileen P.

Abrading

Precision device or process - or with condition responsive...

With indicating

451 11, 451 41, 451278, G11B 5127, B24B 4900

Patent

active

061322903

ABSTRACT:
The present invention relates to an automatic lapping method and a lapping apparatus for lapping a work piece, which is bonded to a row bar, including a thin-film element in order to control the lapping process by accurately measuring height of the work piece. The automatic lapping apparatus may include a lapping plate for lapping a thin-film, which is bonded to a row bar, including a monitoring element having at least an analog resistance value which is analogously varied according to lapping; and a controller for converting the analog resistance value to height of said thin-film element and controlling said lapping plate to stop the lapping process when the height of the thin-film element has reached to a targeted value, wherein said controller employs a previously measured resistance value as a currently measured resistance value when the currently measured resistance value is less than the previously measured resistance value.

REFERENCES:
patent: 5023991 (1991-06-01), Smith
patent: 5136817 (1992-08-01), Tabata et al.
patent: 5203119 (1993-04-01), Cole
patent: 5214589 (1993-05-01), Tang
patent: 5337015 (1994-08-01), Lustig et al.
patent: 5913550 (1999-06-01), Watanuki

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