Automated inspection system for residual metal after chemical-me

Optics: measuring and testing – By configuration comparison – With comparison to master – desired shape – or reference voltage

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451 41, G01B 1100

Patent

active

061080934

ABSTRACT:
An automated endpoint detection process for detecting residual metal on a surface of an integrated circuit substrate after subjecting said surface to a chemical-mechanical polishing process is described. The process includes obtaining a baseline reflected radiation signal for a surface on a standard integrated circuit substrate surface that is substantially free of residual metal, directing radiation generated from a radiation source on at least a portion of the surface of the integrated circuit substrate, detecting a resulting reflected radiation signal from the surface of the integrated circuit substrate and comparing the reflected radiation signal to the baseline reflected radiation signal and thereby determining whether residual metal is present on the surface of the integrated circuit substrate.

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