Automated direct patterned wafer inspection

Details Automated direct patterned wafer inspection Automated direct patterned wafer inspection

1994-06-09

1996-04-30

Boudreau, Leo

Image analysis

Applications

Manufacturing or product inspection

382147, 382148, 348126, G06K 900

Patent

active

055132758

ABSTRACT:
Disclosed is a new self-reference signal processing technique for detecting the location of any nonregularities and defects in a periodic two-dimensional signal or image. Using high-resolution spectral estimation algorithms, the proposed technique first extracts the period and structure of repeated patterns from the image to sub-pixel resolution in both directions, and then produces a defect-free reference image for making comparison with the actual image. Since the technique acquires all its needed information from a single image, on the contrary to the existing methods, there is no need for a database image, a scaling procedure, or any apriori knowledge about the repetition period of the patterns.

REFERENCES:
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patent: 4349880 (1982-09-01), Southgate et al.
patent: 4626907 (1986-12-01), Schedewie
patent: 4771468 (1988-09-01), Batchelder et al.
patent: 4845558 (1989-07-01), Tsai et al.
patent: 4898471 (1990-02-01), Stonestrom et al.
patent: 4969198 (1990-11-01), Batchelder et al.

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