Etching a substrate: processes – Etching of semiconductor material to produce an article...
Patent
1993-12-21
1995-05-16
Breneman, R. Bruce
Etching a substrate: processes
Etching of semiconductor material to produce an article...
216 33, B44C 122
Patent
active
054157269
ABSTRACT:
This invention includes a method of making a bridge-supported accelerometer structure. A first wafer is worked, preferably by bulk micromachining, to provide a proof mass supported by a thin membrane on all sides. The thin membrane has the same thickness as the bridges to be defined therein. The first wafer is bonded to a second wafer having a cavity formed therein. The first wafer is then worked, preferably by plasma etching, to delineate bridges in the thin membrane. The cavity in the second wafer provides damping of the proof mass which reduced bridge breakage as portions of the thin membrane are removed leaving the final bridge-supported accelerometer structure. Combining the two wafers together prior to delineating the bridge provides for handling and processing of a much less fragile structure than the first wafer alone with bridges delineated therein.
REFERENCES:
patent: 4805456 (1989-02-01), Howe
patent: 4882933 (1989-11-01), Peterson
patent: 4922756 (1990-05-01), Henrion
patent: 5115291 (1992-05-01), Stokes
patent: 5166612 (1992-11-01), Murdock
patent: 5177661 (1993-01-01), Zavracky
Logsdon James H.
Staller Steven E.
Breneman R. Bruce
Brooks Cary W.
Chang Joni Y.
Delco Electronics Corporation
Funke Jimmy L.
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