Attachment method for assembly of high density multiple intercon

Details Attachment method for assembly of high density multiple intercon Attachment method for assembly of high density multiple intercon

1997-04-07

1999-12-07

Whitehead, Jr., Carl

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438107, 438622, 438455, 216 20, H01L 214763

Patent

active

059982918

ABSTRACT:
Method of fabricating high density multilayer interconnect structures or flexible HDMI decals. The methods secure a top surface of an HDMI decal fabricated on a rigid substrate to a protective film layer which is in turn adhesively secured to a flat carrier. This structure is then demounted or delaminated from the rigid substrate. The bottom of the HDMI decal, with the protective film layer and flat carrier attached thereto, is secured to a mounting substrate using a relatively thick adhesive layer. After the HDMI decal is adhesively secured to the mounting substrate, the carrier and protective film layer are removed. The top surface of the HDMI decal thus remains flat after it is secured to the mounting substrate, and therefore connection of integrated circuit chips to contact pads on the top surface of the decal is ensured because this surface is flat. The carrier and protective film layer also protects the top surface of the decal while it is secured to the mounting substrate.

REFERENCES:
patent: 5192716 (1993-03-01), Jacobs
patent: 5262351 (1993-11-01), Bureau et al.
patent: 5514613 (1996-05-01), Santadrea et al.
patent: 5691245 (1997-11-01), Bakhit et al.
patent: 5877034 (1999-03-01), Ramm et al.

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