Atomic layer deposition systems and methods including metal...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Multiple layers

Reexamination Certificate

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C438S789000, C257SE21269, C257SE21274

Reexamination Certificate

active

07416994

ABSTRACT:
The present invention provides atomic layer deposition systems and methods that include metal compounds with at least one β-diketiminate ligand. Such systems and methods can be useful for depositing metal-containing layers on substrates.

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