Optics: measuring and testing – By configuration comparison – With photosensitive film or plate
Patent
1996-01-31
1997-06-17
Font, Frank G.
Optics: measuring and testing
By configuration comparison
With photosensitive film or plate
356357, G01B 1106
Patent
active
056402422
ABSTRACT:
An assembly for making thickness measurements in a thin film structure. The assembly comprises a chemical-mechanical planarization (CMP) subassembly for effecting topographical changes in a thin film structure; and, a measuring subassembly for detecting the thickness of a thin film structure, the measuring subassembly interposed with the CMP subassembly so that a thickness measurement can be made during and independent of CMP process operations.
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O'Boyle Martin Patrick
Panner John Charles
Sandwick Thomas Edwin
van Kessel Theodore Gerard
Wickramasinghe Hemantha Kumar
Font Frank G.
International Business Machines - Corporation
Kaufman Stephen C.
Ratliff Reginald A.
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