Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Multiple layers
Reexamination Certificate
2007-10-02
2007-10-02
Lee, Calvin (Department: 2818)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Multiple layers
Reexamination Certificate
active
11136845
ABSTRACT:
A compound semiconductor structure is provided, which includes a GaAs-based supporting semiconductor structure having a surface on which a dielectric material is to be formed. A first layer of gallium oxide is located on the surface of the supporting semiconductor structure to form an interface therewith. A second layer of a Ga—Gd oxide is disposed on the first layer. The GaAs-based supporting semiconductor structure may be a GaAs-based heterostructure such as an at least partially completed semiconductor device (e.g., a metal-oxide field effect transistor, a heterojunction bipolar transistor, or a semiconductor laser). In this manner a dielectric layer structure is provided which has both a low defect density at the oxide-GaAs interface and a low oxide leakage current density because the dielectric structure is formed from a layer of Ga2O3followed by a layer of Ga—Gd-oxide. The Ga2O3layer is used to form a high quality interface with the GaAs-based supporting semiconductor structure while the Ga—Gd-oxide provides a low oxide leakage current density.
REFERENCES:
patent: 4861750 (1989-08-01), Nogawa et al.
patent: 6159834 (2000-12-01), Yu et al.
Medendorp, Jr. Nicholas William
Passlack Matthias
Freescale Semiconductor Inc.
Lee Calvin
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