Arrangement and method for inspecting unpatterned wafers

Optics: measuring and testing – Inspection of flaws or impurities – Surface condition

Reexamination Certificate

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C250S559390, C250S559450, C438S016000

Reexamination Certificate

active

07084965

ABSTRACT:
The invention concerns an arrangement (1) for inspecting preferably unpatterned wafers, and comprises: a first optical inspection device (2) for examining reference wafers (R), which operates using image data processing methods and thereby recognizes defects on the reference wafers; a scattered-light measuring instrument (3) that is calibrated with the reference wafers (R) by defining at least one threshold value for the recognition of defects on wafers (W) to be inspected, and that comprises means (6) for recording the locations of threshold value exceedances for the wafers (W) to be inspected; and a second optical inspection device (4) for examination, only at those locations at which a threshold value exceedance is identified, of the wafers (W) to be inspected, which also comprises a classification device. The scattered-light measuring instrument (3) and the second optical inspection device (4) are arranged in one production line (P) as sequentially located stations. The first optical inspection device (2), on the other hand, is arranged outside the production line (P). A corresponding method is also described.

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F. Passek et al., “Discrimination of Defects on Epitaxial Silicon Wafers”, Electrochemical Society Proceedings, vol. 97/22, pp. 438ff, 1997.

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