Apparatus, method and system for the treatment of a wafer

Details Apparatus, method and system for the treatment of a wafer Apparatus, method and system for the treatment of a wafer

2005-04-12

2005-04-12

Rinehart, K. B. (Department: 3745)

Drying and gas or vapor contact with solids

Process

With nondrying treating of material

C034S428000, C034S380000, C034S359000, C034S367000, C034S393000, C034S443000, C034S460000, C034S497000, C414S935000, C414S941000

Reexamination Certificate

active

06877250

ABSTRACT:
In an apparatus for a treatment of a wafer at elevated temperatures, the wafer is taken out of the reactor after heat treatment with the help of a mechanical transport apparatus which preferably grips the wafer around the circumference and on the under side. The transport apparatus includes a wafer surrounding ring. The wafer is placed in a floating wafer reactor where it is cooled in a controlled manner. Transport for further action or treatment then takes place.

REFERENCES:
patent: 4148575 (1979-04-01), Siryj
patent: 4622918 (1986-11-01), Bok
patent: 4860687 (1989-08-01), Frijlink
patent: 4987856 (1991-01-01), Hey et al.
patent: 4990047 (1991-02-01), Wagner et al.
patent: 5094013 (1992-03-01), Martin et al.
patent: 5241758 (1993-09-01), Cruz et al.
patent: 5281320 (1994-01-01), Turner et al.
patent: 5411076 (1995-05-01), Matsunaga et al.
patent: 5431700 (1995-07-01), Sloan
patent: 5855465 (1999-01-01), Boitnott et al.
patent: 5863170 (1999-01-01), Boitnott et al.
patent: 5911461 (1999-06-01), Sauter et al.
patent: 5974682 (1999-11-01), Akimoto
patent: 6068089 (2000-05-01), Brooks et al.
patent: 6097005 (2000-08-01), Akimoto
patent: 6111225 (2000-08-01), Ohkase et al.
patent: 6183565 (2001-02-01), Granneman et al.
patent: 6209220 (2001-04-01), Raaijmakers
patent: 6215106 (2001-04-01), Boas et al.
patent: 6285102 (2001-09-01), Matsuoka et al.
patent: 3608783 (1987-09-01), None
patent: 0 829 904 (1998-03-01), None
patent: 1012004 (2000-11-01), None
patent: WO 9013687 (1990-11-01), None
patent: WO 9801890 (1998-01-01), None
patent: WO 9836444 (1998-08-01), None
patent: WO 9903138 (1999-01-01), None

Affiliated with

Also associated with

Rating

Apparatus, method and system for the treatment of a wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus, method and system for the treatment of a wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus, method and system for the treatment of a wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3425180