Apparatus for transporting and polishing wafers

Details Apparatus for transporting and polishing wafers Apparatus for transporting and polishing wafers

2006-05-16

2006-05-16

Nguyen, Dung Van (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

By optical sensor

C451S285000

Reexamination Certificate

active

07044833

ABSTRACT:
The present invention discloses an apparatus for transporting wafers. The apparatus includes a tray having a sloped portion on which a wafer having a sidewall can be mounted, a plurality of guides that disposed about the tray, and a plurality of sensors for detecting the position of the sidewall of the wafer with respect to the tray on which it is mounted by sensing the position of the sidewall. The present invention also discloses an apparatus for polishing wafers having the apparatus for transporting wafers comprising the circular tray and a plurality of guides and a plurality of sensors above-mentioned.

REFERENCES:
patent: 6520839 (2003-02-01), Gonzalez-Martin et al.
patent: 6629883 (2003-10-01), Katsuoka et al.
patent: 6672820 (2004-01-01), Hanson et al.
patent: 6878044 (2005-04-01), Sakurai et al.
patent: 6916231 (2005-07-01), Wakabayashi
patent: 2003-133271 (2003-09-01), None
patent: 20-0247999 (2001-09-01), None
patent: 10-0353916 (2002-09-01), None
patent: 2003-0031790 (2003-04-01), None
English language abstract of Korean Publication No. 2003-0031790.
English language abstract of Korean Publication No. 20-0247999.
English language abstract of Korean Publication No. 10-0353916.
English language abstract of Japanese Publication No. 2003-133271.

Affiliated with

Also associated with

Rating

Apparatus for transporting and polishing wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for transporting and polishing wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for transporting and polishing wafers will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3540915