Apparatus for singulating and bonding semiconductor chips,...

Details Apparatus for singulating and bonding semiconductor chips,... Apparatus for singulating and bonding semiconductor chips,...

2007-08-21

2007-08-21

Lee, Calvin (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C228S180500

Reexamination Certificate

active

11245440

ABSTRACT:
An apparatus for singulating and bonding semiconductor chips includes a singulating station and a mounting station. In the singulating station, a semiconductor chip is provided with a bonding wire by a bonding tool and lifted off a carrier film. Then, in the mounting station, the semiconductor chip is placed on a chip mounting surface and fixed in place. The bonding wire is guided to a contact-connection surface of the circuit carrier and bonded to this surface.

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patent: 62-005837 (1987-01-01), None
patent: WO 03/089305 (2003-10-01), None

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