Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Patent
1985-11-27
1987-09-15
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
118 50, 118728, 134105, 156643, 156646, 204298, B44C 122, C23F 102, C03C 1500
Patent
active
046937773
ABSTRACT:
An apparatus for producing semiconductor devices in which a plurality of treatment chambers such as a load chamber, an etching chamber, a sputtering chamber, an ion implantation chamber, a CVD chamber, an unload chamber, a transfer chamber, a heat-treatment chamber, a rinsing chamber and the like, are connected in series preferably in the form of U for effecting various treatments of semiconductor wafers. Wafer conveyor and transfer means are provided to move a wafer through the treatment chambers in which the wafer is normally sequentially processed and these conveyor and transfer means are reversible so that a wafer which has been moved into a predetermined treatment chamber can be returned to the inlet of the apparatus, whereby the quantity of dust attached to the wafer in each treatment chamber can be easily and positively detected. In the heat-treatment chamber, the hot air is discharged against the upper surface of the wafer on the belt conveyor while a vertically movable heating plate is brought into contact with the undersurface of the wafer so that the uniform heat-treatment can be accomplished within a short period of time. Furthermore, the inner surfaces of the etching chamber or the like are lined with detachable linings made of, for instance, aluminum so that maintenance is facilitated.
REFERENCES:
patent: 4477311 (1984-10-01), Mimura et al.
patent: 4487678 (1984-12-01), Noguchi et al.
Hazano Shigeki
Iwami Munenori
Jyo Hidetaka
Sensui Reiichiro
Shibagaki Masahiro
Kabushiki Kaisha Tokuda Seisakusho
Kabushiki Kaisha Toshiba
Powell William A.
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