Apparatus for processing an object by gas plasma with a reduced

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

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118723, 118724, C23C 1308, C23C 1400

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active

049197835

ABSTRACT:
For processing an object by the use of gas plasma generated in a predetermined gas, such as nitrogen, in cooperation of an electromagnetic wave with a static, an alternating, and a rotating magnetic field, an apparatus comprises a magnet around a first part of a reaction vessel to produce the magnetic field substantially parallel to an interface at which the first part is contiguous with a second part of the reaction vessel so as to confine the gas plasma within the first part. The interface may be open ultraviolet rays and charged or neutral particles produced by the gas plasma. Alternatively, an optical window may be disposed at the interface to use only the ultraviolet rays with the object held within the second part.

REFERENCES:
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patent: 4426275 (1984-01-01), Meckel et al.
patent: 4492620 (1985-01-01), Matsuo et al.
patent: 4511451 (1985-04-01), Sella et al.
patent: 4610770 (1986-09-01), Saito et al.
patent: 4664747 (1987-05-01), Sekiguchi et al.
patent: 4705595 (1987-11-01), Okudaira et al.
Itoo et al, "Semiconductor World", Jan. 1985, pp. 73-74 and pp. 103-106.

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