Drying and gas or vapor contact with solids – Apparatus – With apparatus using centrifugal force
Reexamination Certificate
2005-02-01
2005-02-01
Wilson, Pamela A (Department: 3749)
Drying and gas or vapor contact with solids
Apparatus
With apparatus using centrifugal force
C034S528000
Reexamination Certificate
active
06848194
ABSTRACT:
An apparatus for spin drying a semiconductor wafer includes a hollow core spindle and a chuck assembly having grippers for supporting a wafer at an edge thereof. A sleeve is disposed in the central opening of the spindle and a manifold is disposed in the upper end of the sleeve. A capacitance sensor is affixed to the manifold. In another apparatus, an arm having a capacitance sensor mounted thereon is positioned such that the capacitance sensor is disposed above a space to be occupied by a wafer that is supported by the grippers. An additional apparatus includes an arm having a light source and a detector mounted thereon. The light source directs light toward a surface of a wafer such that light that reflects off of the surface is substantially perpendicular to that surface. The detector is positioned to measure the intensity of the reflected light.
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Lam Research Corporation
Martine & Penilla LLP
Wilson Pamela A
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