Apparatus for monitoring a metal layer during chemical...

Abrading – Precision device or process - or with condition responsive... – Computer controlled

Reexamination Certificate

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C451S008000, C451S288000

Reexamination Certificate

active

06878036

ABSTRACT:
A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around a second portion of the core. The sensor can be positioned on a side of the polishing surface opposite the substrate. The sensor can detect a phase difference between a drive signal and a measured signal.

REFERENCES:
patent: 4005359 (1977-01-01), Smoot
patent: 4112365 (1978-09-01), Larson et al.
patent: 4303885 (1981-12-01), Davis et al.
patent: 4467281 (1984-08-01), Davis et al.
patent: 4556845 (1985-12-01), Strope et al.
patent: 4673877 (1987-06-01), Sakamoto et al.
patent: 4715007 (1987-12-01), Fujita et al.
patent: 4716366 (1987-12-01), Hosoe et al.
patent: 4829251 (1989-05-01), Fischer
patent: 4849694 (1989-07-01), Coates
patent: 5003262 (1991-03-01), Egner et al.
patent: 5213655 (1993-05-01), Leach et al.
patent: 5237271 (1993-08-01), Hedengren
patent: 5343146 (1994-08-01), Koch et al.
patent: 5355083 (1994-10-01), George et al.
patent: 5433651 (1995-07-01), Lustig
patent: 5541510 (1996-07-01), Danielson
patent: 5559428 (1996-09-01), Li et al.
patent: 5644221 (1997-07-01), Li et al.
patent: 5660672 (1997-08-01), Li et al.
patent: RE35703 (1997-12-01), Koch et al.
patent: 5731697 (1998-03-01), Li et al.
patent: 5889401 (1999-03-01), Jourdain et al.
patent: 5893796 (1999-04-01), Birang et al.
patent: 6004187 (1999-12-01), Nyui et al.
patent: 6068539 (2000-05-01), Bajaj et al.
patent: 6309276 (2001-10-01), Tsai et al.
patent: 6558229 (2003-05-01), Kimura et al.
patent: 6707540 (2004-03-01), Lehman et al.
patent: 20020077031 (2002-06-01), Johansson et al.
patent: 0 460 348 (1991-12-01), None
patent: 1 116 552 (2001-07-01), None
patent: 0146684 (2001-06-01), None

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