Apparatus for measuring temperature of wafer

Details Apparatus for measuring temperature of wafer Apparatus for measuring temperature of wafer

1990-12-20

1992-04-21

Cuchlinski, Jr., William A.

Thermal measuring and testing

Temperature measurement

In spaced noncontact relationship to specimen

374208, 324158R, G01J 512, G01K 114

Patent

active

051062003

ABSTRACT:
An apparatus for measuring the temperature of a wafer by a non-contact method includes a supporting device, at a specified position on which the wafer is placed horizontally. A thermocouple is provided with a heat collector at one end thereof. The heat collector is disposed near but in non-contacting relationship with the wafer at the specified position. A reflector capable of reflecting radiant heat is disposed near the heat collector and on the opposite side thereof from the wafer such that radiant heat from the wafer can be efficiently collected by the heat collector.

REFERENCES:
patent: 933543 (1909-09-01), Foster
patent: 3745460 (1973-07-01), Belzer et al.
patent: 3979671 (1976-09-01), Meeker et al.
patent: 4607960 (1986-08-01), Wulff
patent: 4851764 (1989-07-01), Usui
patent: 4864227 (1989-09-01), Sato
patent: 4890245 (1989-12-01), Yomoto et al.
patent: 4965515 (1990-10-01), Karasawa
patent: 4989991 (1991-02-01), Pecot et al.

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