Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With means for passing discrete workpiece through plural...
Reexamination Certificate
2006-07-18
2006-07-18
Lindsay, Jr., Walter L. (Department: 2812)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With means for passing discrete workpiece through plural...
C156S345310, C118S719000
Reexamination Certificate
active
07077929
ABSTRACT:
An apparatus for manufacturing a semiconductor includes a polyhedral transfer chamber, a first process module for forming a gate dielectric layer by ALD, and a second process module for thermally treating the gate dielectric layer. The first process module is in communication with a first side of the transfer chamber. The second process module in communication with a second side of the transfer chamber. The apparatus further includes at least one load-lock chamber in communication with a third side of the transfer chamber.
REFERENCES:
patent: 6530993 (2003-03-01), Hwang et al.
patent: 2003/0136515 (2003-07-01), Saeki et al.
patent: 2005/0064714 (2005-03-01), Mui et al.
patent: 1994-16602 (1994-07-01), None
patent: 010004969 (2001-01-01), None
patent: 10200020030994 (2002-04-01), None
patent: 2002-40445 (2002-05-01), None
English Language Abstract of Korean Publication No. 010004969 A.
English Language Abstract of Korean Publication No. 10200020030994 A.
English language abstract of Korean Publication No. 1994-16602.
English language abstract of Korean Publication No. 2002-40445.
Kim Jae-Woong
You Young-Sub
Lindsay Jr. Walter L.
Marger & Johnson & McCollom, P.C.
Samsung Electronics Co,. Ltd.
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