Apparatus for full wafer deposition

Details Apparatus for full wafer deposition Apparatus for full wafer deposition

1994-09-22

1996-12-31

Bueker, Richard

Coating processes

Coating by vapor, gas, or smoke

118715, 118719, 118725, 118728, C23C 1600

Patent

active

055892248

ABSTRACT:
The present invention provides a shield arrangement that prevents deposition in the area of the chamber surrounding the substrate. This shield arrangement is equipped with a wall-like member which surrounds a substrate, and includes a projecting annular flange and a substrate support which extends in the horizontal direction beyond the substrate, and includes a groove therein. The annular flange is received in the groove to shield the deposition region of the chamber from the remainder of the chamber.

REFERENCES:
patent: 5065698 (1991-11-01), Koike
patent: 5094885 (1992-03-01), Selbrede
patent: 5135629 (1992-08-01), Sawada
patent: 5169684 (1992-12-01), Takagi
patent: 5192371 (1993-03-01), Shuto
patent: 5213650 (1993-05-01), Wang
patent: 5228501 (1993-07-01), Tepman
patent: 5238499 (1993-08-01), van de Ven

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