Apparatus for controlling temperature in the processing of a sub

Details Apparatus for controlling temperature in the processing of a sub Apparatus for controlling temperature in the processing of a sub

1991-04-05

1992-09-15

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156626, 156345, 118725, 427 8, 20419213, 20419233, H01L 2100

Patent

active

051474980

ABSTRACT:
The temperature of a substrate, such as a semiconductor wafer, is controlled in the processing of the substrate, such as sputtering, etching, deposition, or the like. According to the present invention, an accurately controlled temperature environment may be achieved by measuring the temperature and emissivity of heat from the surface of the substrate being processed, remotely as well as on a real-time basis, and correcting the temperature to reflect the actual temperature according to the emissivity as measured.

REFERENCES:
patent: 4147571 (1979-04-01), Stringfellow et al.
patent: 4543576 (1985-09-01), Hieber et al.
patent: 4913790 (1990-04-01), Narita et al.
patent: 4987856 (1991-01-01), Hey et al.
The American Heritage Dictionary of the English Language; .COPYRGT.1969; pp. 1336, 427.

Affiliated with

Also associated with

Rating

Apparatus for controlling temperature in the processing of a sub does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for controlling temperature in the processing of a sub, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for controlling temperature in the processing of a sub will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-733983