Abrading – Precision device or process - or with condition responsive... – With indicating
Reexamination Certificate
2005-12-20
2005-12-20
Eley, Timothy V. (Department: 3724)
Abrading
Precision device or process - or with condition responsive...
With indicating
C451S041000, C451S059000, C451S063000, C451S398000
Reexamination Certificate
active
06976903
ABSTRACT:
A CMP system accurately measures eccentric forces applied to carriers for wafer or polishing pad conditioning pucks. An initial coaxial relationship between wafer axis of rotation and a carrier axis is maintained during application of the eccentric force, such that a sensor may measure the eccentric forces. Such initial coaxial relationship is maintained by a linear bearing assembly mounted between the carrier and the sensor. The linear bearing assembly is provided as an array of separate linear bearing assemblies, and may be assembled with a retainer ring in conjunction with a motor for moving the ring relative to the wafer mounted on the carrier so that an exposed surface of the wafer and a surface of the retainer ring to be engaged by the polishing pad are coplanar during the polishing operation.
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Eley Timothy V.
Lam Research Corporation
Martine & Penilla & Gencarella LLP
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