Apparatus for attaching solder balls to BGA package...

Details Apparatus for attaching solder balls to BGA package... Apparatus for attaching solder balls to BGA package...

2005-10-25

2005-10-25

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Including means to apply flux or filler to work or applicator

Solid flux or solid filler

C228S033000

Reexamination Certificate

active

06957760

ABSTRACT:
A method of attaching solder balls to a BGA package using a ball pickup tool is disclosed. An array of solder balls is formed on a first substrate for interconnecting with conductive sites on another substrate. The ball pickup tool picks up balls with a vacuum suction from a fluidized ball reservoir and utilizes a puff of gas to release the solder ball(s) carried thereon to conductive sites of a substrate for bonding thereto. In another embodiment, the bond pads of a substrate are coated with a flux or adhesive and lowered into a fluidized ball reservoir for direct attachment of solder balls.

REFERENCES:
patent: 3716907 (1973-02-01), Anderson
patent: 3719981 (1973-03-01), Steiz
patent: 4074342 (1978-02-01), Honn et al.
patent: 4332341 (1982-06-01), Minetti
patent: 4462534 (1984-07-01), Bitaillou et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4688939 (1987-08-01), Ray
patent: 4783722 (1988-11-01), Osaki et al.
patent: 4788767 (1988-12-01), Desai et al.
patent: 4830264 (1989-05-01), Bitaillou et al.
patent: 4871110 (1989-10-01), Fukasawa et al.
patent: 4897918 (1990-02-01), Osaka et al.
patent: 4914814 (1990-04-01), Behun et al.
patent: 4932883 (1990-06-01), Hsia et al.
patent: 4934309 (1990-06-01), Ledermann et al.
patent: 5058178 (1991-10-01), Ray
patent: 5060844 (1991-10-01), Behun et al.
patent: 5088639 (1992-02-01), Gondotra et al.
patent: 5109601 (1992-05-01), McBride
patent: 5118027 (1992-06-01), Braun et al.
patent: 5133495 (1992-07-01), Angulas et al.
patent: 5155905 (1992-10-01), Miller, Jr.
patent: 5162257 (1992-11-01), Yung
patent: 5203075 (1993-04-01), Angulas et al.
patent: 5219117 (1993-06-01), Lin
patent: 5255839 (1993-10-01), da Costa Alves et al.
patent: 5279045 (1994-01-01), Odashima et al.
patent: 5284287 (1994-02-01), Wilson et al.
patent: 5330574 (1994-07-01), Nakagawa et al.
patent: 5410806 (1995-05-01), Schneider
patent: 5419481 (1995-05-01), Lasto et al.
patent: 5431332 (1995-07-01), Kirby et al.
patent: 5442852 (1995-08-01), Danner
patent: 5445313 (1995-08-01), Boyd et al.
patent: 5467913 (1995-11-01), Namekawa et al.
patent: 5482736 (1996-01-01), Glenn et al.
patent: 5491301 (1996-02-01), Akiba et al.
patent: 5492266 (1996-02-01), Hoebener et al.
patent: 5504277 (1996-04-01), Danner
patent: 5506385 (1996-04-01), Murakami et al.
patent: 5516030 (1996-05-01), Denton
patent: 5540250 (1996-07-01), Mullins
patent: 5540377 (1996-07-01), Ito
patent: 5574801 (1996-11-01), Collet-Beillon
patent: 5591941 (1997-01-01), Acocella et al.
patent: 5597110 (1997-01-01), Melton et al.
patent: 5607099 (1997-03-01), Yeh et al.
patent: 5611705 (1997-03-01), Pfaff
patent: 5615823 (1997-04-01), Noda et al.
patent: 5617990 (1997-04-01), Thompson, Sr.
patent: 5620927 (1997-04-01), Lee
patent: 5626277 (1997-05-01), Kawada
patent: 5633204 (1997-05-01), Tago et al.
patent: 5637832 (1997-06-01), Danner
patent: 5643831 (1997-07-01), Ochiai et al.
patent: 5657528 (1997-08-01), Sakemi et al.
patent: 5658827 (1997-08-01), Aulicino et al.
patent: 5668059 (1997-09-01), Christie et al.
patent: 5669970 (1997-09-01), Balog et al.
patent: 5672542 (1997-09-01), Schwiebert et al.
patent: 5675889 (1997-10-01), Acocella et al.
patent: 5680984 (1997-10-01), Sakemi
patent: 5685477 (1997-11-01), Mallik et al.
patent: 5687901 (1997-11-01), Hoshiba et al.
patent: 5695667 (1997-12-01), Eguchi et al.
patent: 5704535 (1998-01-01), Thompson, Sr.
patent: 5704536 (1998-01-01), Chen et al.
patent: 5750199 (1998-05-01), Sakemi
patent: 5758409 (1998-06-01), Nakazato
patent: 5788143 (1998-08-01), Boyd et al.
patent: 5867260 (1999-02-01), Sakai
patent: 6065201 (2000-05-01), Sakai
patent: 6069483 (2000-05-01), Maxwell et al.
patent: 6109509 (2000-08-01), Sakai et al.
patent: 6196439 (2001-03-01), Mays et al.
patent: 6254923 (2001-07-01), Boyd et al.
patent: 6268648 (2001-07-01), Fukutomi et al.
patent: 6595408 (2003-07-01), Cobbley et al.
patent: 6641030 (2003-11-01), Freeman et al.
patent: 6766938 (2004-07-01), Cheng et al.
patent: 9843307 (1998-10-01), None
patent: 2278831 (1990-11-01), None
patent: 6023530 (1994-02-01), None
patent: 6163550 (1994-05-01), None

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