Apparatus for and method of surface treatment for microelectroni

Details Apparatus for and method of surface treatment for microelectroni Apparatus for and method of surface treatment for microelectroni

1990-10-17

1994-02-08

Hearn, Brian E.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156643, 427589, 427575, 118723FI, 118723R, 118723MW, 118723I, 20429804, 20429834, 20429836, H01L 2100

Patent

active

052845443

ABSTRACT:
An apparatus for surface treatment according to the present invention used for carrying out dry etching, thin film deposition and so forth is provided with a neutral beam etching apparatus in order to improve etching rate. In an embodiment, microwave wave-guides forming a duplex tube, a discharge tube, a pair of solenoids arranged coaxially, a multiaperture electrode for extracting an ion beam, gas supply pipes, a set of charged particle retarding grids, a device for controlling temperature of a specimen and a vacuum unit are provided.

REFERENCES:
patent: 4450031 (1984-05-01), Ono et al.
patent: 4532199 (1985-07-01), Ueno et al.
patent: 4624214 (1986-11-01), Suzuki et al.
patent: 4668337 (1987-05-01), Sekine
patent: 4678681 (1987-07-01), Obayashi et al.
patent: 4687544 (1987-08-01), Bersin
patent: 4761199 (1988-08-01), Sato
patent: 4778561 (1988-10-01), Ghambari
patent: 4869780 (1989-09-01), Yang et al.
patent: 4956043 (1990-09-01), Kanetomo et al.
Journal Of Electrochemical Society, Solid-State Science and Technology, vol. 126, Jun. 1979, pp. 1024-1028, Manchester, US; K. Suzuki et al. "The roles of ions and neutral active species in microwav plasma etching".
Japanese Journal Of Applied Physics, B-1-2, 1989; 21st Conference On Solid State Devices And Materials, Tokyo, 28-30 Aug. 1989, pp. 153-156; K. Nojiri et al.: "Microwave plasma etching of silicon dioxide for half-micron ULSIs".
"Directional Reactive Ion Etching at Oblique Angles"; by Boyd et al.; Appl. Phys. Lett. 36(7), pp. 583-585.

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