Apparatus for aligning electrodes in a process chamber to...

Details Apparatus for aligning electrodes in a process chamber to... Apparatus for aligning electrodes in a process chamber to...

2011-04-12

2011-04-12

Chen, Keath T (Department: 1712)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

Having glow discharge electrode gas energizing means

Reexamination Certificate

active

07922866

ABSTRACT:
Positional relationships are established in a process chamber. A base is configured with a lower electrode surface to support a wafer, and an upper electrode has a lower surface. A drive mounted on the base has a linkage connected to the upper electrode. A fixture placed on the lower surface moves into a desired orientation of the lower electrode. With the upper electrode loosely connected by the linkage to the drive, the fixture transfers the desired orientation to the upper electrode. The linkage is tightened to maintain the desired orientation, the fixture is removed and a process exclusion insert is mounted to the upper electrode. The drive moves the upper electrode and the insert to define an inactive process zone between the upper electrode and the wafer on the lower electrode to protect a central area of the wafer during etching of a wafer edge environ around the central area.

REFERENCES:
patent: 5826345 (1998-10-01), Hendricks
patent: 2004/0238488 (2004-12-01), Choi et al.
patent: 3928971 (1991-03-01), None
English abstact and translation of DE 3928971, Neumann, Mar. 1991.

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