Apparatus and process for controlling the temperature of a...

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With workpiece support

Reexamination Certificate

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Reexamination Certificate

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06890403

ABSTRACT:
A process for controlling the temperature of a substrate in a plasma processing reactor chamber comprising flowing a cooling gas to a substrate at a flow pressure; and determining a temperature of the substrate. The difference between the temperature of the substrate and a desired temperature of the substrate is determined; and a pressure by which the flow pressure of the cooling gas is to be adjusted is determined. The flow pressure of the cooling gas to the substrate is adjusted in accordance with the determined pressure.

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