Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With mechanical mask – shield or shutter for shielding workpiece
Reexamination Certificate
2011-03-22
2011-03-22
Hassanzadeh, Parviz (Department: 1712)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With mechanical mask, shield or shutter for shielding workpiece
Reexamination Certificate
active
07909960
ABSTRACT:
Improved mechanisms of removal of etch byproducts, dielectric films and metal films near the substrate bevel edge, and etch byproducts on substrate backside and chamber interior is provided to avoid the accumulation of polymer byproduct and deposited films and to improve process yield. An exemplary plasma etch processing chamber configured to clean a bevel edge of a substrate is provided. The chamber includes a bottom edge electrode surrounding a substrate support in the plasma processing chamber, wherein the substrate support is configured to receive the substrate and the bottom edge electrode and the substrate support are electrically isolated from each other by a bottom dielectric ring. The chamber also includes a top edge electrode surrounding a gas distribution plate opposing the substrate support, wherein the top edge electrode and the gas distribution plate are electrically isolated from each other by a top dielectric ring, and the top edge electrode and the bottom edge electrode are configured to generate a cleaning plasma to clean the bevel edge of the substrate.
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Bailey III Andrew D.
Kim Yun-sang
Chen Keath T
Hassanzadeh Parviz
IP Strategy Group, P.C.
Lam Research Corporation
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