Apparatus and methods for upgraded substrate processing system w

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

118723ME, 20429838, H05H 100

Patent

active

060398345

ABSTRACT:
An apparatus and methods for an upgraded CVD system that provides a plasma for efficiently cleaning a chamber, according to a specific embodiment. Etching or depositing a layer onto a substrate also may be achieved using the upgraded CVD system of the present invention. In a specific embodiment, the present invention provides an easily removable, conveniently handled, and relatively inexpensive microwave plasma source as a retrofit for or a removable addition to existing CVD apparatus. In a preferred embodiment, the remote microwave plasma source efficiently provides a plasma without need for liquid-cooling the plasma applicator tube. In another embodiment, the present invention provides an improved CVD apparatus or retrofit of existing CVD apparatus capable of producing a plasma with the ability to efficiently clean the chamber when needed.

REFERENCES:
patent: 4433228 (1984-02-01), Nishimatsu et al.
patent: 4576692 (1986-03-01), Fukuta et al.
patent: 4736304 (1988-04-01), Doehler
patent: 4738748 (1988-04-01), Kisa
patent: 4831963 (1989-05-01), Saito et al.
patent: 4898118 (1990-02-01), Murakami et al.
patent: 4909184 (1990-03-01), Fujiyama
patent: 4946549 (1990-08-01), Bachman et al.
patent: 4996077 (1991-02-01), Moslehi et al.
patent: 5008593 (1991-04-01), Schlie et al.
patent: 5082517 (1992-01-01), Moslehi
patent: 5084126 (1992-01-01), McKee
patent: 5111111 (1992-05-01), Stevens et al.
patent: 5133825 (1992-07-01), Hakamata et al.
patent: 5134965 (1992-08-01), Tokuda et al.
patent: 5173641 (1992-12-01), Imahashi et al.
patent: 5211995 (1993-05-01), Kuehnle
patent: 5234526 (1993-08-01), Chen et al.
patent: 5234529 (1993-08-01), Johnson
patent: 5266364 (1993-11-01), Tamura et al.
patent: 5282899 (1994-02-01), Balmashnov et al.
patent: 5306985 (1994-04-01), Berry
patent: 5364519 (1994-11-01), Fujimura et al.
patent: 5387288 (1995-02-01), Shatas
patent: 5405492 (1995-04-01), Moslehi
patent: 5449434 (1995-09-01), Hooke et al.
patent: 5462602 (1995-10-01), Misiano et al.
patent: 5466991 (1995-11-01), Berry
patent: 5489362 (1996-02-01), Steinhardt et al.
patent: 5498308 (1996-03-01), Kamarehi et al.
patent: 5520771 (1996-05-01), Kanai et al.
patent: 5540812 (1996-07-01), Kadomura
patent: 5545289 (1996-08-01), Chen et al.
patent: 5558717 (1996-09-01), Zhao et al.
patent: 5567241 (1996-10-01), Tsu et al.
patent: 5788778 (1998-08-01), Shang et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Apparatus and methods for upgraded substrate processing system w does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus and methods for upgraded substrate processing system w, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and methods for upgraded substrate processing system w will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-727389

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.