Apparatus and methods for packaging electronic devices for...

Details Apparatus and methods for packaging electronic devices for... Apparatus and methods for packaging electronic devices for...

2011-04-19

2011-04-19

Andújar, Leonardo (Department: 2826)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

C257S431000, C257S466000

Reexamination Certificate

active

07927898

ABSTRACT:
Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.

REFERENCES:
patent: 2004/0129991 (2004-07-01), Lai et al.

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