Apparatus and method of manufacturing semiconductor device

Details Apparatus and method of manufacturing semiconductor device Apparatus and method of manufacturing semiconductor device

1995-04-19

1996-06-25

Breneman, R. Bruce

Coating apparatus

Gas or vapor deposition

Crucible or evaporator structure

118715, 118719, 118300, 261142, 261 16, 427250, C23C 1600, H01L 2160

Patent

active

055296343

ABSTRACT:
An evaporation chamber for forming fine metal particles is separated from a film formation chamber in which the substrate having a metal film such as a metal column thereon is placed during metal film deposition. The pressure of the film formation chamber is set to be lower than that of the evaporation chamber, and the fine metal particles are sprayed on the substrate by the pressure difference to form the metal column. Therefore, a wiring layer, a connection electrode for connecting the wiring layer to another wiring layer, and the like can easily be formed by a small number of steps.

REFERENCES:
patent: 4389973 (1983-06-01), Suntola
patent: 4582731 (1986-04-01), Smith
patent: 4714047 (1987-12-01), Ikeda
patent: 4848273 (1989-07-01), Mori
patent: 5328078 (1994-07-01), Okumura

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