Apparatus and method for wafer backside inspection

Details Apparatus and method for wafer backside inspection Apparatus and method for wafer backside inspection

2005-08-02

2005-08-02

Raevis, Robert (Department: 2856)

Measuring and testing

Inspecting

Reexamination Certificate

active

06923077

ABSTRACT:
An automatic wafer backside inspection may automatically inspect a backside of a semiconductor wafer to look for contamination, cracks, scratches and the like. An inspection apparatus may comprise a wafer cassette with slots to hold a plurality of wafers. A wafer transfer arm may be located near the wafer cassette. A wafer flip/aligner may be operable to flip and align wafers. A wafer inspecting unit may be located adjacent the wafer flip/aligner and be operable to inspect the backside of wafers flipped by the flipper aligner. A wafer buffer stage may be located between the wafer cassette and the wafer flip/aligner for temporarily holding a wafer. The wafer transfer arm may transfer wafers to/from or amongst at least two of the wafer cassette, the wafer flip/aligner, the wafer inspection unit and the wafer buffer stage.

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