Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate
2007-03-27
2007-03-27
Norton, Nadine G. (Department: 1765)
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
C438S691000, C438S689000, C451S005000, C451S006000, C451S285000, C451S287000, C451S288000, C451S398000, C216S085000, C216S088000, C216S089000
Reexamination Certificate
active
11036865
ABSTRACT:
The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish, and more particularly to a polishing apparatus having a workpiece transfer robot for transferring a workpiece from one operation to the next.The polishing apparatus according to the present invention comprises a polishing section including a top ring for holding a workpiece to be polished and a turntable having a polishing surface for polishing a surface of the workpiece held by the top ring; a cleaning section including a cleaning device for cleaning the workpiece that has been polished in the polishing section; and a workpiece transfer robot for transferring the workpiece to be polished to the polishing section or for transferring the workpiece that has been polished to the cleaning section. In this case, the workpiece transfer robot comprises a robot body; at least one arm operatively coupled to the robot body by at least one joint; a holder mechanism mounted on the arm for holding the workpiece; and a seal mechanism at the joint for preventing liquid from entering an interior of the joint, the seal mechanism.
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Boo Jae-Phil
Cho Chan-Woo
Jung Ki-Hong
Kang Jong-Muk
Kim Ik-Joo
Angadi Maki
Marger & Johnson & McCollom, P.C.
Norton Nadine G.
Samsung Electronics Co,. Ltd.
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