Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2006-05-02
2006-05-02
Nguyen, Thanh (Department: 2813)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
C438S016000, C250S492100, C250S492200, C356S237100
Reexamination Certificate
active
07037735
ABSTRACT:
A defect inspection method includes radiating an illumination slit-shaped beam having lights substantially parallel to a longitudinal direction to a substrate having circuit patterns in a direction inclined at a predetermined gradient relative to the direction of a line normal to the substrate and inclined at a predetermined gradient on a surface with respect to a group of main straight lines of the circuit patterns with its longitudinal direction oriented almost perpendicularly to a direction of a movement of the substrate. Scattered light reflected by a defect such as a foreign particle existing on the illuminated substrate is received and converted into a detection signal by using an image sensor, and defect judging is effected of an extracted a signal indicating a defect such as a foreign particle on the basis of the detection signal output.
REFERENCES:
patent: 3790287 (1974-02-01), Cuthbert et al.
patent: 4153336 (1979-05-01), Minami et al.
patent: 4330205 (1982-05-01), Murakami et al.
patent: 4468120 (1984-08-01), Tanimoto et al.
patent: 4877326 (1989-10-01), Chadwick et al.
patent: 4898471 (1990-02-01), Vaught et al.
patent: 4929081 (1990-05-01), Yamamoto et al.
patent: 4936664 (1990-06-01), Haraguchi et al.
patent: 5162867 (1992-11-01), Kohno
patent: 5177559 (1993-01-01), Batchelder et al.
patent: 5233191 (1993-08-01), Noguchi et al.
patent: 5410400 (1995-04-01), Shishido et al.
patent: 5461474 (1995-10-01), Yoshii et al.
patent: 5463459 (1995-10-01), Morioka et al.
patent: 5486919 (1996-01-01), Tsuji et al.
patent: 5565979 (1996-10-01), Gross
patent: 5604585 (1997-02-01), Johnson et al.
patent: 5726740 (1998-03-01), Shiozawa et al.
patent: 5774575 (1998-06-01), Tanaka et al.
patent: 5777729 (1998-07-01), Aiyer et al.
patent: 5801824 (1998-09-01), Henley
patent: 5805278 (1998-09-01), Danko
patent: 5912735 (1999-06-01), Xu
patent: 5923461 (1999-07-01), Allen et al.
patent: 5963314 (1999-10-01), Worster et al.
patent: 6020957 (2000-02-01), Rosengaus et al.
patent: 6052478 (2000-04-01), Wihl et al.
patent: 6608676 (2003-08-01), Zhao et al.
patent: 000294643 (1988-12-01), None
patent: 59-934 (1986-01-01), None
patent: 62-89336 (1987-04-01), None
patent: 63-029238 (1988-02-01), None
patent: 63-135848 (1988-06-01), None
patent: 64-53132 (1989-03-01), None
patent: 64-88237 (1989-04-01), None
patent: 1-117024 (1989-05-01), None
patent: 1-250847 (1989-10-01), None
patent: 2-223845 (1990-09-01), None
patent: 5-129397 (1993-05-01), None
patent: 5-218163 (1993-08-01), None
patent: 5-036016 (1994-02-01), None
patent: 6-160062 (1994-06-01), None
patent: 6-258047 (1994-09-01), None
patent: 6-258239 (1994-09-01), None
patent: 6-324003 (1994-11-01), None
patent: 7-190739 (1995-07-01), None
patent: 7-294449 (1995-11-01), None
patent: 7-318504 (1995-12-01), None
patent: 8-210989 (1996-08-01), None
patent: 8-271437 (1996-10-01), None
patent: 8-293533 (1996-11-01), None
patent: 9-210919 (1997-08-01), None
patent: 9-243546 (1997-09-01), None
Chikamatsu Shuichi
Jingu Takahiro
Kembo Yukio
Matsumoto Shunichi
Matsunaga Ryouji
Antonelli, Terry Stout and Kraus, LLP.
Hitachi , Ltd.
Hitachi High-Technologies Corporation
Nguyen Thanh
LandOfFree
Apparatus and method for testing defects does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Apparatus and method for testing defects, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus and method for testing defects will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3594865